A leading professional service provider focusing on the global semiconductor distribution industry.
|
Manufacturer |
AMD
|
|
Manufacturer Product Number |
XCZU47DR-2FFVE1156I
|
|
Description |
IC ZUP RFSOC A53 FPGA 1156BGA
|
|
Category
Integrated Circuits (ICs)
Embedded
System On Chip (SoC)
|
Peripherals
DMA, WDT
|
|
Manufacturer
AMD
|
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
|
|
Series
Zynq® UltraScale+™ RFSoC
|
Speed
533MHz, 1.333GHz
|
|
Packaging
Tray
|
Primary Attributes
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
|
|
Part Status
Active
|
Operating Temperature
-40°C ~ 100°C (TJ)
|
|
Architecture
MCU, FPGA
|
Package / Case
1156-BBGA, FCBGA
|
|
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
|
Supplier Device Package
1156-FCBGA (35×35)
|
|
RAM Size
256KB
|
Number of I/O
366
|
Q1: What does the “I” and “-2” designation signify in XCZU47DR-2FFVE1156I? A: The “-2” represents the high-performance speed grade tier for enhanced logic toggle speeds and tighter routing metrics. The “I” suffix stands for Industrial grade, certifying stable operation within a -40°C to +100°C thermal envelope.
Q2: What is the physical dimension and ball matrix of the FFVE1156 package? A: The FFVE1156 is an 1156-ball Flip-Chip Ball Grid Array measuring 35 mm x 35 mm, offering an efficient footprint for dense multi-layer PCB layouts while supporting comprehensive I/O and converter routing.