XC7Z010-3CLG400E | AMD (Xilinx) Zynq-7000 SoC FPGA Chip Commercial Grade In Stock

Manufacturer
AMD
Manufacturer Product Number
XC7Z010-3CLG400E
Description
IC SOC CORTEX-A9 866MHZ 400BGA

product detail

Product Attributes
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Category
Integrated Circuits (ICs)
Embedded
System On Chip (SoC)
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Manufacturer
AMD
Speed
866MHz
Series
Zynq®-7000
Primary Attributes
Artix™-7 FPGA, 28K Logic Cells
Packaging
Tray
Operating Temperature
0°C ~ 100°C (TJ)
Part Status
Active
Package / Case
400-LFBGA, CSPBGA
Architecture
MCU, FPGA
Supplier Device Package
400-CSPBGA (17×17)
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Number of I/O
130
RAM Size
256KB
Base Product Number
XC7Z010
Peripherals
DMA

Product FAQ Section (Targeting Long-Tail B2B Search Queries)

Q1: What does the “E” and “-3” designation signify in XC7Z010-3CLG400E? A: The “-3” indicates the highest performance speed grade tier for this family, offering faster logic operations. The “E” suffix stands for Commercial grade, verifying an operating temperature envelope of 0°C to +85°C.

Q2: What is the physical dimension and ball pitch of the CLG400 package? A: The CLG400 is a 400-ball Chip-Scale Ball Grid Array measuring 17 mm x 17 mm with a standard 0.8 mm ball pitch, offering a balanced mix of I/O capability and compact design layout.

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