|
Manufacturer |
AMD
|
|
Manufacturer Product Number |
XC7Z010-3CLG400E
|
|
Description |
IC SOC CORTEX-A9 866MHZ 400BGA
|
|
Category
Integrated Circuits (ICs)
Embedded
System On Chip (SoC)
|
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
|
|
Manufacturer
AMD
|
Speed
866MHz
|
|
Series
Zynq®-7000
|
Primary Attributes
Artix™-7 FPGA, 28K Logic Cells
|
|
Packaging
Tray
|
Operating Temperature
0°C ~ 100°C (TJ)
|
|
Part Status
Active
|
Package / Case
400-LFBGA, CSPBGA
|
|
Architecture
MCU, FPGA
|
Supplier Device Package
400-CSPBGA (17×17)
|
|
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
|
Number of I/O
130
|
|
RAM Size
256KB
|
Base Product Number
XC7Z010
|
|
Peripherals
DMA
|
Q1: What does the “E” and “-3” designation signify in XC7Z010-3CLG400E? A: The “-3” indicates the highest performance speed grade tier for this family, offering faster logic operations. The “E” suffix stands for Commercial grade, verifying an operating temperature envelope of 0°C to +85°C.
Q2: What is the physical dimension and ball pitch of the CLG400 package? A: The CLG400 is a 400-ball Chip-Scale Ball Grid Array measuring 17 mm x 17 mm with a standard 0.8 mm ball pitch, offering a balanced mix of I/O capability and compact design layout.