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The FTG256 is the BGA member of the LX9 pair: the same 9,152-logic-cell device as the TQG144 version, but with 186 user I/O in a 17 × 17 mm ball-grid package — the variant LCSC’s own LX9 guide names among its hot sellers. It is the standard choice when a Spartan-6 design needs the I/O count the quad-flat package cannot provide. Send your quantity and date-code requirement and we check current availability for this exact variant. Related parts: XC6SLX9-2TQG144C and XC6SLX25-3FTG256C.
Independent distributor in Huaqiangbei, Shenzhen. Date-code and label photos before payment, traceability documents with every lot, third-party testing supported on request.
Whichever your PCB was laid out for. Both are the same LX9 silicon: the FTG256 is a 256-ball BGA with 186 user I/O, the TQG144 a 144-pin TQFP with 102. The BGA part suits dense, machine-assembled boards; the TQFP part is easier to prototype and rework by hand.
Commercial temperature grade, specified 0°C to +85°C (TJ). The I-grade version is specified −40°C to +100°C.
Ask for date-code and label photos of the actual lot, traceability documents, and third-party testing if your volume justifies it. We provide the first two before payment and support the third on request.
The XC6SLX9-2FTG256C offers advanced features suitable for a wide range of applications. Key specifications are listed below.
| Category | Integrated Circuits (ICs), Embedded, FPGAs (Field Programmable Gate Array) |
| Manufacturer | AMD |
| Series | Spartan®-6 LX |
| Packaging | Tray |
| Part Status | Active |
| Number of LABs/CLBs | 715 |
| Number of Logic Elements/Cells | 9152 |
| Total RAM Bits | 589824 |
| Number of I/O | 186 |
| Voltage – Supply | 1.14V ~ 1.26V |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FTBGA (17×17) |
| Base Product Number | XC6SLX9 |