The LX16 is the step up from the LX9 in the same 17 × 17 mm FTG256 footprint: 14,579 logic cells against 9,152, with 186 user I/O. It sits in a large installed base of industrial and communications boards, so most demand is sustainment volume on existing designs rather than new wins. This is the commercial-grade version; the industrial-grade I variant is listed separately and buyers often ask for the pair. Send your quantity and date-code requirement and we check current availability for this exact variant. Related parts: XC6SLX16-2FTG256I and XC6SLX25-3FTG256C.
Independent distributor in Huaqiangbei, Shenzhen. Date-code and label photos before payment, traceability documents with every lot, third-party testing supported on request.
Logic capacity: the LX16 carries 14,579 logic cells, the LX9 9,152, in the same 256-FTBGA (17×17) package. Whether an LX9 design can migrate to the LX16 depends on pin usage and the migration rules in the Spartan-6 packaging guide — confirm with your design engineer before substituting.
Commercial temperature grade, specified 0°C to +85°C (TJ). The I-grade version is specified −40°C to +100°C.
Ask for date-code and label photos of the actual lot, traceability documents, and third-party testing if your volume justifies it. We provide the first two before payment and support the third on request.
The XC6SLX16-2FTG256C offers advanced features suitable for a wide range of applications. Key specifications are listed below.
| Category | Integrated Circuits (ICs), Embedded, FPGAs (Field Programmable Gate Array) |
| Manufacturer | AMD |
| Series | Spartan®-6 LX |
| Packaging | Tray |
| Part Status | Active |
| Number of LABs/CLBs | 1139 |
| Number of Logic Elements/Cells | 14579 |
| Total RAM Bits | 589824 |
| Number of I/O | 186 |
| Voltage – Supply | 1.14V ~ 1.26V |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FTBGA (17×17) |
| Base Product Number | XC6SLX16 |