| Military FPGA Dynamic Burn-In System |
BM-F01 |
The FPGA dynamic burn-in system is specially designed for burn-in qualification tests of FPGA devices. Aiming at the characteristics of FPGA devices with multiple power supplies and large power consumption current, it provides 4 channels of high-power precision power supplies with a maximum output capability of 5V/50A. It supports a high-speed differential clock up to 200MHz to realize real burn-in tests of devices under high-temperature environment. The system has an automatic FPGA bitstream download function, which effectively solves the problem that conventional burn-in equipment cannot configure FPGAs. It also supports automatic import of VEC-format simulation vectors, which can greatly improve burn-in production efficiency. It specifically addresses technical bottlenecks of FPGA device burn-in as well as pain points such as time-consuming operation, high labor intensity and low reliability. |
– Multi-fan horizontal air duct high-temperature test chamber: Temperature can be set arbitrarily from room temperature to 150℃, equipped with dual over-temperature protection devices
– Test capacity: 16 zones in the complete system (single-board single-zone type), capable of burn-in testing 16 different types of devices simultaneously
– Each zone is equipped with 4 channels of power supplies, with a maximum output capability of 5V/50A
– Each zone provides 64 channels of digital signals, each channel supports tri-state output
– Maximum frequency of each digital signal: 20MHz
– Maximum programming depth of each signal: 8Mbit
– Supports frequency detection of 64 channels of output signals
– Supports automatic FPGA bitstream download function
– Can save data such as temperature, voltage, current and frequency of the burn-in system and generate reports |
| Military FPGA Dynamic Burn-In System |
BM-F02 |
The FPGA dynamic burn-in system is specially designed for burn-in qualification tests of FPGA devices. Aiming at the characteristics of FPGA devices with multiple power supplies and large power consumption current, it provides 4 channels of high-power precision power supplies with a maximum output capability of 5V/50A. It has an automatic FPGA bitstream download function, which effectively solves the problem that conventional burn-in equipment cannot configure FPGAs. The system supports automatic import of VEC-format simulation vectors, which can greatly improve burn-in production efficiency. It specifically addresses technical bottlenecks of FPGA device burn-in as well as pain points such as time-consuming operation, high labor intensity and low reliability. |
– Multi-fan horizontal air duct high-temperature test chamber: Temperature can be set arbitrarily from room temperature to 150℃, equipped with dual over-temperature protection devices
– Test capacity: 32 zones in the complete system (single-board single-zone type), capable of burn-in testing 32 different types of devices simultaneously
– Each zone is equipped with 4 channels of power supplies, with a maximum output capability of 5V/50A
– Each zone provides 64 channels of digital signals, each channel supports tri-state output
– Maximum frequency of each digital signal: 20MHz
– Maximum programming depth of each signal: 8Mbit
– Supports frequency detection of 64 channels of output signals
– Supports automatic FPGA bitstream download function
– Can save data such as temperature, voltage, current and frequency of the burn-in system and generate reports |
