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Manufacturer |
AMD
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Manufacturer Product Number |
XCZU4EG-2FBVB900E
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Description |
IC SOC CORTEX-A53 900FCBGA
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Category
Integrated Circuits (ICs)
Embedded
System On Chip (SoC)
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Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
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Manufacturer
AMD
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Speed
533MHz, 600MHz, 1.3GHz
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Series
Zynq® UltraScale+™ MPSOC EG
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Primary Attributes
Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
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Packaging
Tray
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Operating Temperature
0°C ~ 100°C (TJ)
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Part Status
Active
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Package / Case
900-BBGA, FCBGA
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Architecture
MCU, FPGA
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Supplier Device Package
900-FCBGA (31×31)
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Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
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Number of I/O
204
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RAM Size
256KB
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Base Product Number
XCZU4
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Peripherals
DMA, WDT
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Q1: What does the “E” and “-2” designation signify in XCZU4EG-2FBVB900E? A: The “-2” represents the high-performance speed grade tier, offering faster logic operation and improved timing parameters over standard-speed variants. The “E” suffix stands for Extended Commercial grade, certifying stable operation within a 0°C to +100°C thermal envelope.
Q2: What is the benefit of choosing the FBVB900 package for the XCZU4EG? A: The FBVB900 is a 900-ball flip-chip BGA package measuring 31 mm x 31 mm, which provides an increased matrix count for routing complex board interfaces and managing high-speed I/O requirements compared to smaller pin-count footprints.