A leading professional service provider focusing on the global semiconductor distribution industry.
|
Manufacturer |
AMD
|
|
Manufacturer Product Number |
XC7Z030-2FFG676I
|
|
Description |
IC SOC CORTEX-A9 800MHZ 676FCBGA
|
|
Category
Integrated Circuits (ICs)
Embedded
System On Chip (SoC)
|
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
|
|
Manufacturer
AMD
|
Speed
800MHz
|
|
Series
Zynq®-7000
|
Primary Attributes
Kintex™-7 FPGA, 125K Logic Cells
|
|
Packaging
Tray
|
Operating Temperature
-40°C ~ 100°C (TJ)
|
|
Part Status
Active
|
Package / Case
676-BBGA, FCBGA
|
|
Architecture
MCU, FPGA
|
Supplier Device Package
676-FCBGA (27×27)
|
|
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
|
Number of I/O
130
|
|
RAM Size
256KB
|
Base Product Number
XC7Z030
|
|
Peripherals
DMA
|
Q1: What does the “I” and “-2” designation signify in XC7Z030-2FFG676I? A: The “-2” denotes the high-performance speed grade tier for faster system execution. The “I” suffix indicates Industrial grade, verifying a strict operational temperature threshold of -40°C to +100°C.
Q2: What is the physical size and pitch of the FFG676 package? A: The FFG676 is a 676-ball Fine-pitch Chip-Scale Ball Grid Array measuring 27 mm x 27 mm with a standard 1.0 mm ball pitch, providing optimal signal distribution for high I/O density designs.