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| Item | Details |
|---|---|
| Part Number | B88E1512RQC |
| Protocol Compliance | IEEE 802.3 (10BASE-T/100BASE-TX/1000BASE-T, 100BASE-FX/1000BASE-X), IEEE 1588 V2 (PTP), IEEE 802.1AS |
| Interface Support | RGMII, SGMII, 1.25GHz SERDES, MDC/MDIO management interface |
| Data Rate | 10M/100M/1000M, 1.25G SERDES |
| Voltage | V<sub>AVDD18</sub>=3.3V, V<sub>AVDD18</sub>=1.8V, V<sub>AVDDCI18</sub>=1.8V, V<sub>DVDD</sub>=1V |
| Clock | 25MHz working clock |
| Package | CQFN 56 |
| Compatible Part | 88E1512-NNP |
| Category | Parameter | Specification |
|---|---|---|
| Basic Information | Part Number | B88E1512RQC |
| Product Category | Gigabit Ethernet Physical Layer Chip (Gigabit Ethernet PHY) | |
| Manufacturer/Brand | BMTI (772nd Institute) | |
| Communication Link | Supported Standards | IEEE 802.3ab (10/100/1000Base-T/TX) |
| Transmission Rate | 1000 Mbps (High-Speed) / Backward compatible with downshifting modes | |
| Data Interface | RGMII / SGMII / MII (High-flexibility interfaces) | |
| Space-Grade Features | Radiation Hardening | TID ≥ 100krad(Si) / SEL Immune |
| Operating Environment | -55°C to +125°C Full-temperature reliability | |
| Power Management | Ultra-low operating power (Optimized for on-board satellite power constraints) | |
| Package | Package Specification | High-reliability QFP / BGA ceramic sealed package |