Microsystem Integration2

Product Model Main Function Operating Frequency (MHz) Operating Voltage (V) Package Type Main Application Fields
鸿芯一号 HXBQ01A1 Programmable logic: Max ≥933MHz, ≥320K logic units, ≥26Mb block memory, ≥1120 DSP modules, peak performance (symmetric FIR) ≥1232GMACS; Main processor: Max ≥1GHz (32-bit, compatible with ARM/Thumb instructions, supports reconfigurable management); Built-in 12-bit DAC/ADC broadband 2×2 RF transceiver (70MHz~6.0GHz, 200KHz~56MHz bandwidth). 933 Vccint: 1
Vcco: 1.2~3.3
PBGA1930 New equipment (unmanned systems, earth observation satellites, manned spaceflight) for high-intelligence, high-bandwidth, high-real-time, miniaturized programmable systems
鸿芯一号 HXBQ01A2 Programmable logic: Max ≥933MHz, ≥690K logic units, ≥52Mb block memory, ≥3600 DSP modules, peak performance (symmetric FIR) ≥1232GMACS; Main processor: Max ≥1GHz (32-bit, compatible with ARM/Thumb instructions, supports reconfigurable management); Built-in 12-bit DAC/ADC broadband 4×4 RF transceiver (70MHz~6.0GHz, 200KHz~56MHz bandwidth). 933 Vccint: 1
Vcco: 1.2~3.3
PBGA1930 New equipment (unmanned systems, earth observation satellites, manned spaceflight) for high-intelligence, high-bandwidth, high-real-time, miniaturized programmable systems
鸿芯二号 HXBQ02A1 Programmable logic: Max ≥775MHz, ≥860K logic units, ≥115.3Mb block memory, ≥2280 DSP modules; Main processor: Max ≥1GHz (32-bit, compatible with ARM/Thumb instructions, supports reconfigurable management); Built-in 14-bit DAC/ADC broadband 2×2 RF transceiver (75MHz~6.0GHz, max 200MHz bandwidth). 775 Vccint: 1
Vcco: 1.2~3.3
PBGA1930 New equipment (unmanned systems, earth observation satellites, manned spaceflight) for high-intelligence, high-bandwidth, high-real-time, miniaturized programmable systems
鸿芯三号 HXBQ03A1 32.5M-gate RF-integrated FPGA: Supports multi-voltage protocols (max 1.25Gb/s); 840 DSP modules (25×18 multipliers, 48-bit adders); 445×36Kbit BRAM (FIFO/ECC); 10 CMTs; 16 GTX transceivers (10.3125Gb/s); 1 PCIe2.1 module; Built-in 256Mbit NOR Flash (self-configuration); Built-in 12-bit DAC/ADC 2×2 RF transceiver (70MHz~6.0GHz, 200KHz~56MHz bandwidth). 933 Vccint: 1
Vcco: 1.2~3.3
PBGA1156 Missile-borne data links, control equipment, airborne communication devices (for miniaturized programmable systems)
BM3610MCB/BM3610MY Embedded ARM926EJ-S processor (32-bit double-precision FPU, 256KB SRAM, CPU Standby); Supports external 16MB SRAM; Built-in 2×2-channel MIL-STD-1553B bus controller, 8Rx/8Tx ARINC429 controller, 4 CAN, 2 SPI, 1 I₂C, 64 GPIO, 10 UART; Integrated 16MB SPI Flash, 1M-gate FPGA (96 programmable IOs), 8-channel 12-bit AD (max 1MSPS). 150 Core: 1.5
I/O: 3.3
CCGA440/PBGA440 Integrated electronics & control systems (airborne, missile-borne, shipborne, vehicle-mounted)
BM8672MY 2 power output channels: 0.8V~4.0V adjustable (3A max per channel, 90% peak efficiency); Monotonic start to pre-bias output, external capacitor soft-start, UV/OV power-good indicator, adjustable UVLO, channel sequencing. 0.6 Input: 3.0~6.3V
Single-channel output: 0.8V~4V (adjustable)
PBGA121 Power supply for integrated circuits in various environments
BM8673MY 3 power output channels: 2 DC-DC (0.8V~4.0V adjustable, 3A max, 90% efficiency; soft-start, UV/OV indicator, UVLO, sequencing) + 1 LDO (1.2V~5.0V adjustable, 1A max; current limiting, overheat shutdown). 0.6 DC-DC input: 3.0~6.3V, output: 0.8V~4V (adjustable)
LDO input: 2.7V~9V, output: 1.25V~5.0V (adjustable)
PBGA121 Power supply for integrated circuits in various environments
*BM8674MY 4 power output channels: Input 4V~14V or 2.375V~14V (external bias); 0.6V~5.5V adjustable (4A max per channel; current-mode control, fast transient response, parallelable for higher current); Supports voltage tracking, internal temp diode, OV/OC/overheat protection; External frequency sync (0.8~1.2). 1 (supports external sync 0.8~1.2) Input: 4V~14V or 2.375V~14V (external bias)
Single-channel output: 0.6V~5.5V (adjustable)
PBGA77 Power supply for multi-power-domain integrated circuits in various environments

product detail

Product Model Main Function Operating Frequency (MHz) Operating Voltage (V) Package Type Main Application Fields
BM8685NYB Designed for laser gyro control systems (DSP+FPGA architecture): Built-in dual-core domestic floating-point DSP (main CPU); 1M-gate SRAM-based FPGA (with clock manager, configurable RAM, rich I/O for signal acquisition/instruction transmission); Integrated 256Mb serial FLASH, 6-channel op-amps, and on-chip peripherals (ADC/DAC/PWM/CAN/SCI/EMIF/USB); Supports signal acquisition, gyro control, data processing, etc. Programmable logic unit: 300
ADC unit: 200
ADC unit 2: 1.1
DAC unit: 30
1.2V, 1.5V, 2.5V, 3.3V, 5V PBGA484 Control systems (e.g., laser gyro control) requiring signal acquisition, data processing, program storage, and communication
BAF1000C64Y 64-channel Analog Acquisition Microsystem (for telemetry 采编): 1M-gate programmable logic unit (300MHz, 8 clock managers, multi-level storage); 4Mbit Flash configuration memory, 64Mb SPI Flash data memory; 14-bit ADC (0~5V input, max 10MSPS); 64-channel analog switch (±15V/15V, ≤600Ω, ≤1000ns); 4Rx/4Tx RS422 bus. Programmable logic unit: 300
ADC unit: 10
PGA Vccint: 1.5V
FPGA Vcco: 1.2V~3.3V
AD VDDA/VDDD: 5V
AD VDDDR: 3.3V
Analog switch: ±15V (dual)/15V (single)
PBGA576 Miniaturized programmable systems for launch vehicle telemetry analog acquisition, data processing, and transmission
BQ250S04 250k-gate Integrated FPGA: 92 available IOs (supports multi-voltage single-ended/differential protocols, max 622Mb/s); 24×18×18 multipliers, 24×18Kbit BRAM, 8 DCMs; Built-in configuration memory. 300 Vccint: 1.5
Vcco: 1.2~3.3
PBGA169 Control equipment, ground/airborne communication devices (for miniaturized programmable systems)
BQ250S04ANYB196 250k-gate Military-grade Integrated FPGA: 92 available IOs (supports multi-voltage single-ended/differential protocols, max 622Mb/s); 24×18×18 multipliers, 24×18Kbit BRAM, 8 DCMs; Built-in configuration memory. 300 Vccint: 1.5
Vcco: 1.2~3.3
PBGA196 Control equipment, ground/airborne communication devices (for miniaturized programmable systems)
BQPA300NYB 1M-gate Integrated FPGA: 100 available IOs (supports multi-voltage protocols, max 622Mb/s); 40×18×18 multipliers, 40×18Kbit BRAM, 8 DCMs; Built-in configuration memory; Pin-compatible with MicroChip APA300. 300 Vccint: 1.5
Vcco: 1.2~3.3
PBGA144 Control equipment, ground/airborne communication devices (for miniaturized programmable systems)
BQ3P1000B1NYB 1M-gate Integrated FPGA: 177 available IOs (supports multi-voltage protocols, max 622Mb/s); 40×18×18 multipliers, 40×18Kbit BRAM, 8 DCMs; Built-in configuration memory; Pin-compatible with MicroChip A3P1000. 300 Vccint: 1.5
Vcco: 1.2~3.3
PBGA256 Control equipment, ground/airborne communication devices (for miniaturized programmable systems)
BQAX1000BG624N 3M-gate Integrated FPGA: IOs (supports multi-voltage protocols, max 622Mb/s); 96×18×18 multipliers, 96×18Kbit BRAM, 12 DCMs; Smart refresh unit; 16Mbit anti-fuse config memory, 32Mbit flash PROM. 300 Vccint: 1.5、1.8
Vcco: 1.2~3.3
PBGA624 Integrated solutions for control/communication/processing (e.g., missile-borne, ground, airborne scenarios)
BQ3500S64 3.5M-gate Wide-range Integrated FPGA: 34816 logic units, 192 DSP48E, 2 CMT; 164 IOs (50 pairs: 1.5/1.8/2…

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